Rated Voltage

32 VDC

Rated current

5.3 - 7.5 A

Breaking Capacity

100 A

Characteristic

Time-Lag T

Mounting

PCB,SMT

Admissible Ambient Temp.

-40 °C to 140 °C

Material: Housing

Fiber-reinforced plastic, UL 94V-0

Material: Terminals

Copper, Ni/Au-plated

Unit Weight

0.01 g

Storage Conditions

0 °C to 40 °C, max. 70% r.h.

Storage Capability

max. 3 years␣@  25 °C in original packaging

Product Marking

Rated current

Soldering Methods

Reflow
Soldering Profile

Solderability

245 °C / 3 sec acc. to IEC 60068-2-58, Test Td

Resistance to Soldering Heat

250 ±5 °C / 30 ±5 sec acc. to JEDEC J-STD-020

Moisture Sensitivity Level

MSL 1, J-STD-020 

Case Resistance

acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)

Flammability

UL 94V-0
(acc. to EIA/IS-722, Test 4.12)

Damp heat, steady state

MIL-STD-202, Method 103 
 (1000h / 85°C / 85% humidity)

Immersion

MIL-STD-202, Method 104 Condition B 

Thermal Shock

MIL-STD-202, Method 107
(300 air-to-air cycles: -40 to +140°C)

Operational Life

MIL-STD-202, Method 108 Condition D
1000h @ 0.63 x In @ 125°C

Vibration, High Frequency

MIL-STD-202, Method 204 Condition D

Mechanical Shock

MIL-STD-202, Method 213 Condition F

Resistance to Solvents

MIL-STD-202, Method 215
(acc to. EIA/IS-722, Test 4.11)

Temperature Cycling

JESD22 Method JA-104 

Flame Retardance

AEC-Q200-001 

Board Flex

AEC-Q200-005 

Terminal Strength

AEC-Q200-006